Electronics Forum | Mon Jul 12 05:01:30 EDT 2010 | cobar
Please follow the paste suppliers specs for the paste as an indicator.Most people think that if they follow the paste suppliers recommendations to the T it will be a perfect profile but this is not the case.Play around with preheat settings but follo
Electronics Forum | Thu May 09 08:36:18 EDT 2019 | solderkingchris
Hi, You can work on improving stencil design, having the perfect profile and other process improvements but it may be the paste itself letting you down. We have put a lot of work into developing our solder pastes to significantly reduce voiding. Y
Electronics Forum | Wed Nov 03 19:29:18 EST 2004 | hyabro
One of my customer had an oven made of galvanized metal. when he rised the temperature for lead free application the zinc from the alloy(blower turbine and housing,...) was melted and was removed .I offered to my customer an used oven tornado made by
Electronics Forum | Fri Mar 29 11:02:04 EDT 2019 | robl
Not sure it's always a great route as the smaller ovens are going to struggle to get a perfect profile for a consistent result, especially on bigger boards with higher layer counts and mixed technology. You may want to take a quick look at a batch va
Electronics Forum | Tue Oct 26 16:51:18 EDT 1999 | John Thorup
Hi nards I'm not quite sure what your question is. If you mean is paste volume more important than the reflow profile the answer is no. Belt speed is just a part of creating a reflow profile and all aspects I.E. pasting, placing and reflow are jus
Electronics Forum | Tue Jul 27 06:34:14 EDT 2010 | bwet
Recently we have been placing and reworking quite a few Linear LGA DC converter modules. These are LGA packages with integrated passive components which become easily disturbed in reflow. Even with perfect bumping techniques on the LGA using the poly
Electronics Forum | Wed Jun 21 17:45:32 EDT 2000 | dmunro
My Process Eng. left the Co. and I'm left with a screen printer not set up,profiles are perfect, PNP is fantastic, solder ball city! Please HELP Disgrunteld Tec.
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Thu Feb 21 03:25:58 EST 2008 | jlawson
I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet in LF (sac305) soldering. We found that the solder tended to be attracted to the plating on the part and off the actual pad (silver Immersion). This c
Electronics Forum | Fri Nov 06 12:15:19 EST 2015 | derrikf
Also, for anyone who's taken an interest in this thread: We just received samples of Henkel/Loctite's room temperature stable(yes, you read that right), halide-free, lead-free pastes, both the GC 10 and the GC 3W (which is a water soluble/wash paste
