Electronics Forum: phosphorus analysis enig (Page 1 of 5)

Phosphorus Crystal Formation

Electronics Forum | Tue Nov 14 02:53:05 EST 2006 | saaitk

Thanks for your input folks. I will have to get back to our customer regarding the analysis as it was them that carried it out. If I can get more details then I will post them. For my own benefit, is phosphorus crystal formation to be expected using

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat

I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif

Phosphorus Crystal Formation

Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef

You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a

ENIG Thickness for Flex

Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef

Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and

Black pad defect

Electronics Forum | Thu Mar 27 14:09:41 EST 2003 | Enrique Chairez

Hi All, I have observed this problem with one PCB supplier, the portion of the PCB area affected was cut and observed in SEM (Scanning Electron Microscope) and submitted to an EDX (Energy Disperse X ray analysis), finding Phosphorus levels higher

nickel corrosion

Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps

Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone

ENIG poor wetting

Electronics Forum | Wed Jul 31 17:35:16 EDT 2002 | davef

* Finally, when soldered by hand, do the problem pads take solder? Yes, the XRF analysis will be interesting.

Wave Soldering to ENIG Pads

Electronics Forum | Wed Sep 05 08:06:08 EDT 2007 | davef

The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the c

exessive yellow-gold coloring in the solder pot with tin-silver-copper alloy

Electronics Forum | Mon Sep 25 15:32:21 EDT 2023 | joeljacobo

hello colleagues, Hoping that everyone is doing well, I am reaching out to you in the hope that your experience can help me. We have a wave solder with sac0307 alloy and the pot has turned a golden color, at first I thought it was common tin oxidat

Sulfamate Nickel Finish

Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave

Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro

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