Electronics Forum | Tue Apr 07 22:34:14 EDT 2009 | 1036
Board delaminated after reflow - see attached picture. Does moisture cause this problem?
Electronics Forum | Wed Apr 08 07:49:25 EDT 2009 | davef
We don't view this as "board delamination." It looks more like "solder mask bubbling." It may be the picture. Please describe the issue or enclude additional pictures.
Electronics Forum | Wed Apr 08 09:28:25 EDT 2009 | swag
We had the exact same problem in early stages of lead-free. Very random positions of defect + some boards were 100% O.K. and others were an explosion of what I see in your picture. Turned out to be bad processing/materials from board house. I'm do
Electronics Forum | Mon Oct 20 21:57:58 EDT 2008 | jdt13
The problem that I see is the pads not soldered and I can see on the X-Ray the solder on the pad after reflow, and yes the solder has melted in a uniform fashion, I have not measured the diference of temperatures in each pad of the PCB, the size is a
Electronics Forum | Fri Jun 18 15:04:19 EDT 1999 | Scott Cook
| Scott, | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very forum. Since I
Electronics Forum | Fri Jun 18 15:54:29 EDT 1999 | M Cox
| | Scott, | | | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. | | I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very foru
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Sun Sep 22 02:32:33 EDT 2013 | alexeis
Hi, If your PCB is large, you waste a time. Any picture, you takes, will be with corner distortion. I suggest you to: 1. use AOI (manually or automatically) 2. try simulation of your PCB production before real SMT production process 3. use human FAI
Electronics Forum | Tue Jul 22 22:27:48 EDT 2008 | edmaya33
Our CP643E machine fails to recognise narrow view on its parts camera and confirmed that the VME48108 Picture processing board is the reason. The part number is AEEPN1603. Can anybody have the idea how much will it cost of i purchase a new one? How a
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
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