Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry
Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on
Electronics Forum | Thu May 06 18:36:06 EDT 2004 | gustavo
I can help you, if define what type of components you used: Thru hole(axial,radial, pin insertion etc..) axial: milimetrics or standar(span of .200" or .350" ) radial 2.5mm , 5mm or 7.5 mm SMT (chip shooter(1206,0805,0603 ,sot 23 etc or more small
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Wed Feb 09 09:54:50 EST 2000 | JAX
Trying to place PTH components with an SMT machine is possible but maybe not plausible. Would you have to buy specialized tools and equipment for the job ( gripper nozzles ). Are the machines you have capable. i.e.. Would you need camera modification
Electronics Forum | Thu Nov 13 12:49:45 EST 2014 | dyoungquist
I have no experience running a "move the board" selective solder so can not compare the 2 methods..... We have been using an RPS Rhythm "move the pot/nozzle" system since 2008. We are using it solder thru hole components onto boards that often have
Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
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