Electronics Forum | Wed Sep 25 02:52:25 EDT 2002 | jkhaiar
Hi There Good point from all contributers.Depending on the coast effect and production ability we used a heat resistant coating directly applied to the plastic base of the PCI connector in a very dense SMT PCB.we used a short pulse soldering by run
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Wed Oct 23 12:06:09 EDT 2002 | russ
It sounds like you already know the answer! How much does it cost you to solder P.T.H. by hand (number of pins/per hour, / cost of assembler) vs. wave preparation and time of loading/masking etc... Cost of rework from each process? Only you can mak
Electronics Forum | Thu Oct 24 01:10:54 EDT 2002 | pizz
thank ur kind help. the above two processes,which is more reliably,other words,robust? I am in a dilemma. some suggest that 50 pins is the critical point,once exceed the quantity,the hand soldering is not practical. I prefer to two sides reflow.but
Electronics Forum | Thu Oct 17 16:09:18 EDT 2002 | Hamish
Has anyone had trouble with SMD machine placing of SC-79 (approx 0402) varicaps (infineon, alpha, philips)? Using the recommended pads from Infineon I am struggling to get the component to place flat on the PCB and the pins to wet properly every time
Electronics Forum | Sun Oct 27 07:56:58 EST 2002 | wongmanchung
Does any expert here know the specification of board deflection when we mounting component by pick and place machine? That is when the nozzle place the chip on the pcb, the board will have some deflection. And are there any requirment that we need t
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
Electronics Forum | Thu Jan 16 17:54:12 EST 2003 | Ren�
Hi burb , reflow temps are same than other profiles just follow your solder paste recomendations , Will help you a lot a solder paste with Silver , or if you want to eliminate completely the granular looking , use nitrogen with your oven ( You will s
Electronics Forum | Mon Jan 20 01:46:24 EST 2003 | Claudia
I am looking for a FPBGA adapter (pin 256 pitch 1.00mm size 17mm x 17mm). We need the adapter to interconnect the FPBGA from the handset board to a SW test board. Question: Where can I find BGA adapter with different heights? What do we have t
Electronics Forum | Thu Feb 13 10:38:51 EST 2003 | davef
Given that you are bridging front to back, contast the situation with the thiefs used to prevent bridging when wave soldering SOIC. If this is reasonable, the thiefs should be located behind the trailing connector pins. You can prove-out this [and