Electronics Forum | Fri Feb 28 11:08:56 EST 2003 | pauld
I had the same concern. The connector pins are gold also. I am waiting for a response from AMP to supply some of this wonder wax. I can inspect the HASL fabs for proper hole diameter, but I do not have a warm feeling I should be getting involved with
Electronics Forum | Mon Mar 03 11:12:49 EST 2003 | MA/NY DDave
Hi I have seen a few different ways to do this, including hand solder for certain PIH (pin in hole) components as the last operation. Search the archives would be one place for you to look Buy or Borrow one of the SMT Books out in the market. Ther
Electronics Forum | Mon Jun 30 09:43:03 EDT 2003 | russ
Try searching the archives, I saw the formula posted in an earlier thread I belive that relating to Double sided with BGAs but I am not sure I think Dave F. posted this one. So what is an "R"QFP I haven't heard of that one before. Russ
Electronics Forum | Thu Aug 07 16:00:02 EDT 2003 | caldon
Yes you are correct Barry. The Suction tape provides a flat surface for the PNP nozzle to pick -up. In some cases I have seen a plastic "cap" ove rthe pins to provide the same thing. The cap can be reused. Both require, unfortunatly, manual removal
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Mon Aug 25 20:49:27 EDT 2003 | msimkin
Anyone use glass filled nylon connectors utilising the intrusive reflow techique (pin in paste). We are having probe with them becoming brittle after reflow- apparently due to moisture. We are also seeing bubbling on outside plastic.Peak oven temp 22
Electronics Forum | Fri Aug 29 08:37:04 EDT 2003 | davef
From a data sheet [we know it's not Cypress ]: AMD PALCE16V8 Family EE CMOS 20-Pin Universal Programmable Array Logic Programming and Erasing The PALCE16V8 can be programmed on standard logic programmers. It also may be erased to reset a previously c
Electronics Forum | Mon Nov 17 08:01:44 EST 2003 | stefwitt
The format is X,Y Theta of the component center for all placement machines. Gerber data can be useless, unless you have the reference from pin 1 to the component center. Some machines offer a CAD convertion tool. I don't know any machine, which can
Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works
