Electronics Forum | Wed Oct 20 08:40:48 EDT 2010 | xps
Hi everyone, here a question for the SMT production engineers... is possible today mount the fine pitch and ultrafine pitch devices (BGA, QFP, CSP), without using the local fiducials, but using the three standard fiducials of row card only? The corre
Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Tue Dec 15 15:45:50 EST 1998 | Chrys
| Okay here is the deal. I am fairly new to the company here, but one thing I have noticed is that we read way to many fiducials, in my opinon anyway. One for example is this. One assembly was reading 17 fids. Smallest pitch was .25mil I say you
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Thu Sep 09 16:55:17 EDT 2004 | Sue
Yes, a MYDATA TP9 UFP machine can place components up to 2.2" square without any modifications. Refurbished TP9 UFP machines sell for about $45K in the USA.
Electronics Forum | Thu Jun 07 07:11:41 EDT 2001 | stefwitt
8" ). For calculation of the theta angle, the global fiducials should be placed over the diagonal. Component recognition can be improved if your vision system has different light zones. The steep light should be turned off and the flat light turned
Electronics Forum | Wed Jun 06 20:45:54 EDT 2001 | Deon Nungaray
.020" The logic behind this is that from the time of the initial fiducial check, to the time of the critical parts placement which are typically placed last, there may be changes. What I mean by changes is that depending on what type of assembly equi
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