Electronics Forum: placed (Page 3 of 788)

Machine placed masking die cuts

Electronics Forum | Tue Jul 24 17:54:14 EDT 2012 | tombstonesmt

Anyone placing any type of masking material die cuts with SMT equipment? We currently manually place a enormous amount of polymide 1/4 inch dots. Looking into automating this process. We already place 2d labels so doesn't seem to far fetched. Any sug

BGA excursion placed by IP3

Electronics Forum | Tue Jun 18 00:53:09 EDT 2002 | Gang shen

we are surprised to find that ten BGA chips are excursion one line on the board,together the IP3 placed 600 BGA ,it really confused me.anyone have any suggestion for the reason? the BGA IS 20*20-16*16,pitch is 1.27.

SMT Component placed upside down

Electronics Forum | Wed Jul 27 22:43:10 EDT 2005 | crishan

Hi all, Having a major problem with an IC being placed upside down. We pick up the fault at AOI. We have check several reels and the component is not placed upside down by the supplier. Where should I start looking; 1. Are we using an incorrect fee

BGA excursion placed by IP3

Electronics Forum | Tue Jun 18 07:27:32 EDT 2002 | jax

It might just be me?... It is early!... What are you talking about???

Machine placed masking die cuts

Electronics Forum | Thu Aug 09 14:54:10 EDT 2012 | mikesewell

Hover-Davis LP Series .... www.hoverdavis.com Mike

BGA excursion placed by IP3

Electronics Forum | Mon Jul 01 21:55:59 EDT 2002 | Gang shen

oh,sorry,my expresion is not clear.the problem is that about one sixties of BGA is deviation from the proper position one line. my place machine is IP3,the part data of the BGA is okay(in my opinion),our "test vehicle" is poor just by human eyes,with

SMT Component placed upside down

Electronics Forum | Tue Aug 02 11:58:44 EDT 2005 | GS

Are the pick up nozzles metal made (ironmagnetic material)? Some time magnetic residual on metal nozzles can generate pbm like that when chips terminations have nickel and when SOt or similar packages have terminal A42 alloy made. Time ago got pbm l

BGA excursion placed by IP3

Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax

On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni

BGA not level when placed

Electronics Forum | Mon Feb 25 08:14:04 EST 2008 | adetuc

Hi ... We use DRS24C Air-Vac machines for placing BGA devices, and have been having problems with shorts on corners of one device in particular, its a PBGA and its size is 4.5cm square and 15grams weight. When the component is picked up and the com

BGA not level when placed

Electronics Forum | Tue Feb 26 05:10:17 EST 2008 | adetuc

Thanks for the reply Hege, I calibrate the machines every 3 months and have checked that the board carrier to nozzle parralelism is ok. Have tried many different profile settings using a MOLE for readings but still collapsing on one corner. I did


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