Electronics Forum | Wed Apr 22 19:21:42 EDT 1998 | Phillip Hunter
Check with Fuji America Corp. 847-913-0162 ask for service department and/or your local sales rep. I have a quote for a 72mm feeder from Fuji for an IP3 ($ 7,000). Oh yeah, These are customs from Fuji and have no Part Number. (What are you placing
Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
Electronics Forum | Sat Feb 14 13:28:47 EST 1998 | ASHOK DHAWAN
I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The IPC
Electronics Forum | Sat Jan 17 23:28:35 EST 1998 | George Henning
No experience with manual machines. I know OK Industries makes a couple of different flavours. | I am looking to purchase a low cost manual P&P machine. I am interested in the equipment that has an X,Y table and an armrest for the operator. I don't
Electronics Forum | Thu Jan 15 09:13:47 EST 1998 | Roger W Pufky
hello, the person at Universal Instruments to contact about this machine is Mike Yingling at 607-7795899 or email yingling@uic.com , I have given him your e-mail address and a description of what you are looking for . rog | | I am looking
Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
Electronics Forum | Wed Oct 10 21:31:17 EDT 2001 | cnoonan
I used to rework many types of BGA's including ceramic. We always preheated the whole board to around 115 c before attempting to remove or place. Now I find myself in a new company with different ideas. Do any of you have a site that has exact rec
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
