Electronics Forum | Thu Jun 14 02:00:01 EDT 2001 | ianchan
Hi mate, AOI seems great for : 1) missing 2) wrong parts 3) wrong orientation 4) x-y axis misalignment 5) upside down placement 6) etc.....? AOI shucks for : 7) unsolder (joint) defect 8) tombstone / tilt My guys are evaluating AOI m/c, for substi
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Mon Jun 25 20:47:09 EDT 2001 | davef
Much of the focus of pick & place machine supplier development efforts seems to directed towards either: * Head location detection, adjustment, and control. OR * Component location prior to pick-up. OR * Component position error correction after pick
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Thu Jul 26 22:15:57 EDT 2001 | davef
Every time you see one of those �National Geographic� articles showing pictures of clothing sweatshops in developing countries, the girls are sitting at gray Juki sewing machines. Juki placement machines were branded and distributed in the Americas
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Tue Dec 21 16:17:42 EST 1999 | Paul Isaacs
Does anyone know of effective pick and placement optimisation tools for the Yamaha YM84 (Phillips CSM84). We are small manufacturers that have 2 YM84 machines, 1 being a triple pick machine for placing jelly beans and the other for placing IC's. We a
Electronics Forum | Tue Dec 21 07:18:15 EST 1999 | Nick Harris
Edmund, I agree with Wolfgang there is no reason for 0603s to be falling from the bottom side during the top side reflow. I assume what you are having problems with is a higher mass component like a large tantalum, inductor, or perhaps an active de
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