Electronics Forum: placement force calculation (Page 1 of 34)

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Component placement

Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish

I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise

Component placement

Electronics Forum | Wed Apr 17 08:35:17 EDT 2013 | emeto

I currently run Siemens and they have their own recommendations about placement force. Most of the passive parts will be placed using 2N. For some BGA'a we will go about 4N and for certain parts that are very easy to break you should go 1N. All parts

Connector placement

Electronics Forum | Fri Sep 22 08:22:17 EDT 2023 | linux

Hello All, This would be a question for someone with experience in PCB design, Intrusive reflow Narrow profile connector(Electrode Rectangular) L=1mm X W=0.9mm. What shape and size hole is required in the PCB to ensure sufficient solderability and re

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

Pick and placement forces

Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station

This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul

Chip placement pressure check.

Electronics Forum | Wed Apr 28 10:29:04 EDT 2004 | dougt

By "placement pressure" I assume you mean force. I don't know of placement machines that have transducers mounted on the placement spindles that actually measure force. We made a board with a force sensor mounted through a hole so that it was the sa

Pick and placement forces

Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe

Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a

Cost per placement

Electronics Forum | Wed Mar 29 18:45:49 EST 2000 | Dreamsniper

Anyone wants to share his idea or method of calculating Cost per placement in both high and low volume manufacturing environment? Thanks,

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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.