Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman
You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.
Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman
Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p
Electronics Forum | Mon Feb 23 22:53:10 EST 2004 | Ken
Why are you cleaning a NC solder paste?
Electronics Forum | Mon Mar 29 07:21:51 EST 2004 | jdumont
We are also having the same problem here. I was told earlier that it could be a problem with the solder mask during the raw board manufacturing level but then I noticed that the problem was only surfacing on boards that went through the wave. As far
Electronics Forum | Sun Mar 28 22:17:36 EST 2004 | Grant Petty
Hi, I would also be interested in this thread, but our problem has a different twist to it. We have good results from our reflow with Koki no clean paste, however when we pass the boards through the wave solder machine, the flux in that leaves a fog
Electronics Forum | Thu Jan 04 17:26:17 EST 2001 | Cory
We're going to begin conformal coating a few of our assemblies as required by our customer. We're using Kester No clean paste and will use cotton gloves to keep the boards clean while handling. My question is: Do we need to clean the boards prior to
