Electronics Forum | Mon Apr 14 09:39:49 EDT 2003 | davef
Consider: * Sn has a higher melting point than Pb. So the liquidous temperature of this new, non-Sn63 is going to be higher than 183*C. What was the thermal recipe measured on this solder connection? * Next thing we'd do is take problem devices and
Electronics Forum | Wed Apr 16 21:00:50 EDT 2003 | yukim
Hi Dave, thanks! The peak temp on the terminal device is about 210C. Some more questions: The soldering part of the terminal is about the same size as the PCB pad. We observe a lot of voids when we remove the terminal device, whice can be removed v
Electronics Forum | Sun Apr 13 19:55:21 EDT 2003 | yukim
Just some more info: PCB is HAL finished we are using Sn63 solder paste.
Electronics Forum | Sun Apr 13 19:50:20 EDT 2003 | yukim
Hi, We are placing (+) & (-) terminals in SMT. We have just changed the plating of them: from Nickel to Tin (Sn). During the trial, we used the same reflow profile as before changing, and the solder seems different: a bit cold, with some solder paste
Electronics Forum | Thu Apr 17 10:21:53 EDT 2003 | davef
First thing to try is get the solder connection hotter. 210*C is just not warm enough for the 'high' tin content of this connection. Second, it's disconcerning that you don't have good plating on the pad or the terminal. Why can't your board suppl
Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01
Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Mon May 06 20:21:36 EDT 2002 | ianchan
Steve, Hi mate, are you blokes using NC flux paste? or WS paste?
Electronics Forum | Thu Aug 07 09:14:02 EDT 2003 | Carol
Thanks Dave, Much appreciated. Carol
Electronics Forum | Mon May 06 00:09:00 EDT 2002 | ianchan
as a followup thought, what is your current peak reflow deg-C? and reflow timing (sec)? Au/Ni calls for reflow temperature of 217 deg-C for solder fusion that produces secondary eutectic alloy. there was one time we thought 183 deg-C was the magic
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