Electronics Forum | Sun Sep 13 19:56:21 EDT 2009 | 89jeong
Hi All I have a pig problem after reflow. It is a blister in hole.It happend after reflow(Lead free solder) I touched the blister with tweezer. The plating was lifted off easily How do i do? What is a root casue? Drilling or plating? Is it possible
Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
Electronics Forum | Mon Apr 14 09:39:49 EDT 2003 | davef
Consider: * Sn has a higher melting point than Pb. So the liquidous temperature of this new, non-Sn63 is going to be higher than 183*C. What was the thermal recipe measured on this solder connection? * Next thing we'd do is take problem devices and
Electronics Forum | Sun Apr 13 19:50:20 EDT 2003 | yukim
Hi, We are placing (+) & (-) terminals in SMT. We have just changed the plating of them: from Nickel to Tin (Sn). During the trial, we used the same reflow profile as before changing, and the solder seems different: a bit cold, with some solder paste
Electronics Forum | Mon Apr 06 05:51:55 EDT 1998 | Yeo Sye Chai
You can do some reading-up from Circuit Assembly Sep 96 and Jun 97. The problem is that they tell you only the good things and seldom evaluate them critically. I will be interesting to see what you want to do with the metal fence! (I presume is it th
Electronics Forum | Wed Nov 23 08:43:48 EST 2022 | charles_nguyen
I am having problem with plated hole-copper spacing. I don't know if the gap between plated hole and copper can meet the capacity of PCB manufacturers. My board have 0.5oz copper weight on outer layer and distance of 0.177MM between plated hole and c
Electronics Forum | Tue Jul 28 14:34:47 EDT 1998 | upinder singh
Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at the
Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01
Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The
Electronics Forum | Wed Jun 16 13:25:09 EDT 2004 | russ
have you tried a more agressive flux like water soluble to see if the problem goes away? Or can they be hand soldered with no problem? I am basically out of ideas other than a bad nickel or tin finish. The reflow profile didn't seem out of whack f
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
