Electronics Forum | Sun Jul 29 08:36:39 EDT 2001 | davef
You have provided very little information. Two similar possibilites come to mind: poor pad solderability protection and old boards. POOR SOLDERABILITY PROTECTION: Maybe the nickel plating under the gold is oxidized, contaminated, or otherwise very
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Sat Jul 28 03:05:35 EDT 2001 | Frank
Hi guy Does anyone have experiance with printing problem between solder paste water soluble 62/36/2 and gold plating PCB? I do have problem about insufficient solder after printing although I used the same printing parameter as when I print with ano
Electronics Forum | Tue Jul 31 13:46:17 EDT 2001 | Hussman
How fast is your print head speed? I've found that I had to decrease my print head speed to get the paste to stick to gold pads. Not exactly sure why - but the ol' instincts worked well.
Electronics Forum | Wed Aug 01 06:52:25 EDT 2001 | Mark
please look at trying lazer cut stencils. They have trapozoidal shaped apertures and this could assist with the paste releasing onto y the PCB
Electronics Forum | Mon Jul 30 01:34:46 EDT 2001 | mugen
Best thing to do, is consult your solder paste supplier, bring him/her in, and ask for their humble professional opinion? If they refuse, strongly consider switching to a supplier, with responsive "humble professional opinions" to share, one that spr
Electronics Forum | Mon Jul 30 18:52:43 EDT 2001 | Brian W.
You did not provide the stencil thickness or your aspect ratio. If your aspect ratio (Aperture width/stencil thickness) is less than 1.5, the paste will not release correctly from the aperture, leaving paste in the aperture. For example, if your pa
Electronics Forum | Wed Feb 02 20:43:56 EST 2000 | Dave F
KC: Try: 1 http://www.rogers-corp.com/cmu/techindx.htm Circuit Materials Division Tech Tips Index: Techtip #9: Measurement of Copper Thickness by the Weight Method 2 Andy Magee - Flex Guru Senior Consultant, Bourton Groupmagee@donet.com (937) 435-
Electronics Forum | Mon Dec 12 15:57:58 EST 2005 | Samir Nagaheenanajar
4% of the alloy), there is a ternerary phase (not sure if i spelled that right) where the melting point of the alloy is MUCH less than, say, SAC305's. Sn-Bi has also been associated with...... none other than Tin Whiskers. There are some in the in
Electronics Forum | Tue Dec 13 09:15:56 EST 2005 | Samir Nagaheenanajar
5% Bi results in less plasticity * Formation of low temperature (ternerary phases) not detected. I don't advocate the use of Bismuth, per se, but rather I'm just relaying info. that I learned this from a Lead-Free seminar that I attended at Riyadh
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