Electronics Forum | Tue Aug 10 09:26:49 EDT 2004 | davef
You should be able to solder to brass - check with you flux supplier to get their recommendations. The flux you are using may not have enough activation to breakdown the oxides on the brass surface. A word of caution - brass (copper and zinc alloy)
Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe
Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
Electronics Forum | Wed May 11 13:50:30 EDT 2005 | russ
I would contact your paste supplier, bare nickel can be impossible to wet to. How oxidized is it?
Electronics Forum | Thu May 12 07:54:37 EDT 2005 | Rob
We talked about something similar here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051&#Message31805
Electronics Forum | Tue Jun 28 09:13:46 EDT 2005 | russ
It appears that the reflow profile was incorrect or the paste was in bad shape on these boards from what I can see. I personally have never seen a board finish cause this symptom.
Electronics Forum | Tue Jun 28 10:41:57 EDT 2005 | GS
I am not an expert but just for my understanding: - solder paste used ? NC ? other ? - reflow in Air or N2 ? - temp ramp up before soack (�C/second) ? Tnks GS
Electronics Forum | Tue Jun 28 13:23:56 EDT 2005 | Bob Gilbert
Matt, Try a cooler profile by simply speeding up the conveyor by 10%. The difference may be the temperature the pads are reaching between the HASL boards and the Au boards. Are they the same thickness?
