Electronics Forum: plating and shelf and life (Page 1 of 2)

OSP PCB Shelf life and part packs

Electronics Forum | Thu Sep 27 16:40:12 EDT 2012 | davef

Ideally, shelf life should be twelve months from application, but not all OSP's are the same so check manufacturer's instructions

OSP PCB Shelf life and part packs

Electronics Forum | Thu Sep 27 09:53:46 EDT 2012 | testbloke

Anyone ?

OSP PCB Shelf life and part packs

Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke

Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Tin Lead Electrodeposited Plating and Conformal Coat

Electronics Forum | Wed Nov 20 16:47:10 EST 2013 | aaronpavone

I have a right angle male shrouded connector and the whole set of termination leads is tin lead plated, at least 100 microinches thick. Should the entirety of the lead be conformal coated? Or can we have just the joint coated? I know I have coated le

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes

We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin

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