Electronics Forum | Tue Aug 10 09:26:49 EDT 2004 | davef
You should be able to solder to brass - check with you flux supplier to get their recommendations. The flux you are using may not have enough activation to breakdown the oxides on the brass surface. A word of caution - brass (copper and zinc alloy)
Electronics Forum | Fri Jan 21 09:31:38 EST 2005 | clampron
Good Morning Everyone, Does anybody have any information regarding the recommended storage environment for PCB's with tin plating? Any help would be greatly appreciated. Thanks In Advance Chris
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Mon Feb 06 22:33:28 EST 2006 | davef
We can't tell you much without additional information about your situation. For example: * How is the spacer attached to your board? * You specifically mentioned Printec. What are the things about Printec's process that are out of the ordinary for
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Wed Jul 16 00:15:38 EDT 2003 | iman
just out of curiousity, why the special nitrogen cabinet concerns for gold plated flex PCB? common "myth/fact" is gold is an "inert" coating layer that is not going to react with room environment conditions *that much?*. Am learning here, so would ap
Electronics Forum | Wed Apr 04 17:40:39 EDT 2007 | davef
Rob: How do you rework blow-holes and pin-holes? PTH plating thickness SB 1 thou or greater. Epoxy is hydroscopic. So, you should control the environment and/or bake the moisture from the boards before soldering. Search the fine SMTnet Archives f
Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
