Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill
| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so
Electronics Forum | Tue May 04 14:42:58 EDT 1999 | Chrys Shea
| | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I wi
Electronics Forum | Mon May 10 07:53:48 EDT 1999 | Timothy O'Neill
| | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Tue Apr 27 05:04:50 EDT 1999 | Charles Stringer
| Hi Murray! | | Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. | | Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads.
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