Electronics Forum: plug via bga (Page 1 of 43)

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

via under a smd pad ?

Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef

There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

via hole plugging

Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

via in pad

Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef

Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

via in pad

Electronics Forum | Tue Oct 15 15:16:34 EDT 2002 | Abelardo Rodriguez Santana

We run into that issue all the time. If a corrective action must be done right away. Place Kapton tape on the bottom side of the board to cap off the via. If you have room to place tape if not use pink lady or something to plug the via. And weathe

conductive fill via

Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef

Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa

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