Electronics Forum: pocket size too big (Page 1 of 10)

Nozzle size

Electronics Forum | Fri Sep 06 13:49:17 EDT 2002 | soupatech

Question: I am going to start placing 3mm x 3mm plastic smt leds and want the absolute lowest errors caused by the nozzle either dropping or allowing the part to shift. Would a 2.5mm nozzle be too big for the 3mm part. My logic is that the more surfa

Nozzle size

Electronics Forum | Thu Sep 12 16:17:07 EDT 2002 | soupatech

There seems to be less play in the pocket than with other parts i've loaded. I was assuming the large nozzle would work better but for reasons unknown to me it didn't. I also tried a 1mm and had parts all over the machine (can you say hand place 100+

Chip Components with big ground pads - Unsolder

Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack

Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This

Re: BGA ball size reliability

Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff

| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |

SMT Component placed upside down

Electronics Forum | Tue Aug 02 22:44:42 EDT 2005 | crishan

Thanks for the comments everyone. I did not think of checking the nozzles material, I will check this out. GS, What is PBM, is this some sort of ironiser. Also to clarify, we believe the that the pocket size for the component is too big allowing th

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG

I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies

| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven

| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |

SMT Component placed upside down

Electronics Forum | Tue Aug 02 11:17:27 EDT 2005 | Stefan

Tape feeders usually have a fixed pick position regardless of the package size. Is the component body off center in the tape pocket? I hope you can enter an offset in the feeder set up file. Also, perforation holes can deform, if the reel is too hea

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