Electronics Forum: pocket tool insider mini (Page 1 of 1)

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

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