Electronics Forum | Tue Nov 10 13:31:00 EST 2009 | chris0595
When applying the ECCOBOND E3503-1 thermal adhesive to attach a HB-LED to the slug area of a MCPCB, should the OSP coating on the slug area first be removed? I have heard that OSP coatings have poor adhesion properties so I'm wondering how to do this
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Tue Jun 02 14:32:58 EDT 1998 | Chris Fontaine
We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not alwa
Electronics Forum | Tue Jun 02 15:53:32 EDT 1998 | Earl Moon
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Thu Apr 14 14:00:44 EDT 2022 | winston_one
Also at few boards we see excessive voiding, extremily excessive. During solderind some bubbling can be observed near the soldering point. Boards was dried before assembly. May be we have a problem with too thin metallisation - that's why poor adhesi
Electronics Forum | Tue Jun 02 17:36:43 EDT 1998 | Chris Fontaine
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
Electronics Forum | Wed Jun 03 07:13:27 EDT 1998 | Tom Tellinghuisen
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Wed Nov 28 20:45:03 EST 2001 | dougk
We�ve also had glass diode difficulties- poor adhesion while all other parts are fine (including tall parts). I�ve received some interesting information from Heraeus: It seems the newer glues create a much stronger bond to SMD�s, except glass diodes.
Electronics Forum | Fri Jan 05 09:23:10 EST 2001 | Brian Toleno
While there may not be any specific requirement to cleaning prior to coating, cleaning an assembly prior to coating will only serve to increase the reliability and integrity of the coating. Some residues from low-solids fluxes can interact with conf
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