Electronics Forum | Tue Apr 15 03:16:14 EDT 2008 | janz
Hello, We are having a problem with soldering QFP100 (16mmx16mmx1mm). Board dimensions: 70mmx50mmx1.8. FR4 two layers � single SMT assembly. Finish: HASL-lead free Oven: 7 zones �hot air Paste: lead free We have noticed that two groups of legs
Electronics Forum | Fri Nov 23 05:59:18 EST 2018 | premkumar_haribabu
Hi RObl, Thanks for response , sorry to ask again & again . Is cobar paste solved the issues from poor wetting from nickel to PCB soldering,whether it will improve the peel off strenth more than 5 kg ?? as per our current last production , this nic
Electronics Forum | Wed Feb 09 22:08:45 EST 2000 | Dave F
Russ: You've got stop soft-peddling this stuff. This doesn't sound like "poor solderability." It sounds like "no solderability." It also sounds like you�re dead meat. Three places to call: 1 Board supplier to get their suggestions on unsolderab
Electronics Forum | Wed Mar 11 10:58:58 EST 1998 | Earl Moon
| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F
Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Electronics Forum | Tue Jun 28 16:41:07 EDT 2005 | mattkehoe
Yes, .062 fr4. Like I said before, we run a lot of gold boards, as many as 25% of what goes through the shop, and we've never adjusted anything before??? Many of these are bigger by 2 X and much more dense. Reflow is not as shiny as HASL but always u
Electronics Forum | Tue Feb 28 17:22:23 EST 2006 | dave
All, I am currently trying to run a quantity of boards thru my wave machine but I am having serious issues with hole-fill or lack of aswell as others. The boards are HASL finish and due to materials issue they have been waiting for Wave Solder Proce
