Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven
| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s
Electronics Forum | Wed Jul 21 19:16:53 EDT 1999 | Dreamsniper
Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) b) not soldering t
Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
Electronics Forum | Tue Mar 07 11:50:11 EST 2023 | kirill
I am from Israel. We have some chinese guys in our second facility in china, who is working slower than us with a decade old methods (transfering files over usb to the machines from an offline computer). And the only support that we have here is only
Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti
Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou
Electronics Forum | Fri Feb 11 18:09:11 EST 2000 | Glenn Robertson
Russ - I agree with the other guys that the problem could be black pad or some intermetallic problem, possibly related to the "conversion" to HASL finish. But my first guess is still partial reflow at wave soldering. You won't catch it by push
Electronics Forum | Mon Apr 16 10:55:01 EDT 2001 | genny
Happened at my company lots on our older designs. We touched up those pads in house by hand, because the solder joint was very poor. We also did it on SOT 86 pkgs on the gnd pins. When they were touched up, we would get an extra 1/2dB of gain out
