Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Thu Sep 23 08:47:25 EDT 2021 | majdi4
1)Though in many cases the difference between SAC305 and SAC405 was small,and not always statistically significant, it was observed that SAC405 generally outperformed SAC305 joints. Under 0°C to 100°C thermal cycling,no statistically significant
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Thu Jul 20 08:27:18 EDT 2023 | smtusa
I'm not finding much information on Pin transfer being used in modern day equipment for solder paste dispensing. Is there a particular reason time pressure dispensing overtook that method? My understanding is pin transfer is a much faster, more rep
Electronics Forum | Wed Oct 27 11:38:44 EDT 2004 | marc
This has always been a big debate on what is better. Few things to consider before getting into number of zones. What is the throughput and cooling requirements? Throughput is a direct relation to length of heating zone. Longer heating length
