Electronics Forum | Fri Nov 12 17:06:07 EST 2010 | dwong
I would also be concerned about spreading solder paste on the walls/floor/equipment downstream of the air. This would then get transfered to hands, clothing and shoes. In turn, tracked out to the rest of the floor/building or even to the home of em
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Sun Sep 07 17:16:57 EDT 2008 | gregoryyork
OK Pizza it is then, here goes. Dewetting of Ni/Au pads, paste favouring the Tinned component lead hence excess paste wicking on top of the components. Reason is EITHER Nickel migration into the gold due to high levels of Ionics from poor rinse OR mo
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Mon Jan 09 08:25:30 EST 2006 | grantp
Hi, If the stencil was not cleaned well from the previous run, dried paste residue can cause the paste to grab in the stencil. If you have a microscope, check the small apertures for contamination. Regards, Grant
Electronics Forum | Thu Dec 24 04:23:49 EST 2009 | leeg
Has anyone had any experience of using High Melting Point Solder paste in production. We have started to trial some boards using the Solder Paste and are experiencing poor solder joints and solder joints that look grainy.
Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef
The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic
