Electronics Forum | Mon Oct 18 05:31:38 EDT 1999 | Mattias
Does anyone have any experience of popcorning BGA�s in wavesoldering?
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Mon Oct 18 13:17:03 EDT 1999 | John Thorup
Are they visibly "popped" after wave but not before? Remember that many BGAs, especially plastic (PBGA) are very moisture sensitive and even 24 hours or less out of a controlled environment violates exposure rules.
Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F
No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?
Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette
| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Fri Jul 21 14:36:52 EDT 2006 | amol_kane
could also be a component issue...delamination/popcorning of the component....what is the MSL level?
Electronics Forum | Tue Dec 23 21:11:05 EST 2014 | slouis2014
The peak temp. during reflow is 285 degree, at this temperature, would popcorning already occur?Thanks
