Electronics Forum | Mon Jul 07 10:31:27 EDT 2008 | realchunks
Yeah, I burned my Pop-Tarts* this morning. Someone turned the knob on the cafeteria toaster oven. Gotta check them knobs no matter where ya go. (* = Poster has no affiliation with Pop-Tarts or Pop-Tarts products)
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon
Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege
Electronics Forum | Wed Apr 16 19:17:11 EDT 2014 | hegemon
OK, POP already done, and you are mounting the POP device. You are seeing opens. Opens at the device/PWB? or opens at the device/device interface? Or possibly both? 'hege
Electronics Forum | Wed May 07 09:53:39 EDT 2003 | cyber_wolf
Thanks for the response Dave. FYI: In my experience using the light cure adhesive, I have found that the newer the adhesive is the less prone it is to popping off during a reflow cycle. Also I have found that it only takes a very small amount to sec
Electronics Forum | Wed Aug 22 02:50:59 EDT 2012 | robertwillis
Are you having any process problems with Package On Package Assembly? If so why not spend a few hours with the POP Team at SMTA International? You have a great opportunity to see, hear and experience POP in October. However if you really can't join
Electronics Forum | Wed Nov 06 13:01:54 EST 2002 | cvrgirl
Hi, Has anyone experience BGA caps/plugs popped off after assembly on a double sided board? Only the caps on the primary side popped off and exposing copper. thanks! Michelle
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Mon Apr 21 10:50:13 EDT 2014 | cyber_wolf
The top PoP part is what gets dip fluxed or dip pasted. We have had warping issues with these components before but it is almost always the top part. My guess would be bad components if your reflow profile and print process is good to go.
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