Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef
Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di
Electronics Forum | Thu Jan 12 17:42:55 EST 2012 | warwolf
yeah we are getting quotes on a new solder pot, we have used that paint we tested a small sample of it with solder and it seems to be ok, we are doing a full solder alloy change in about two months so we will have a chance to inspect the solder pot a
Electronics Forum | Mon Aug 01 08:38:57 EDT 2005 | kamrant
Joseph, What is the topside temp reading of your board before reaching the pot? Do you have top-heater in your wave machine? It sounds like; you got an insufficient per-heating issue.
Electronics Forum | Thu Sep 03 10:13:38 EDT 2009 | markgray
Our wave started leaking a year ago. We welded, patched inside and outside the pot with metal patch. This works if you leave your wave on all of the time. If you turn your pot on and off consantly, the temperature cycles will bring the crack back. Ty
Electronics Forum | Thu Apr 01 10:49:14 EST 1999 | AF Ng
| Has anyone heard of a problem with catastrophic failure of | large value (200uF) solid tantulum capacitors that have been | exsposed to high humdity. | I suppose that with water moisture seep in the capacitor, the risk is very high that abrupt o
Electronics Forum | Thu Apr 01 14:00:17 EST 1999 | Ron Beasley
| | Has anyone heard of a problem with catastrophic failure of | | large value (200uF) solid tantulum capacitors that have been | | exsposed to high humdity. | | | I suppose that with water moisture seep in the capacitor, the risk is very high tha
Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef
You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough
Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon
| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
