Electronics Forum | Mon Sep 21 10:23:46 EDT 2015 | koprivecj
Please look at folowing link. http://shrani.si/f/3l/xt/3ZHqDv6X/padconnectproblem.png I think that there would be no problem with full pouring the via. But i don't know if it is good to fully pour the PAD in inner layers? Any suggestions?
Electronics Forum | Wed Nov 04 10:37:24 EST 2009 | adlsmt
Is anyone using asphalt to pot assemblies? What temperature do you pour it at? Thanks! Craig
Electronics Forum | Sat Jan 06 10:12:51 EST 2001 | Dave F
Vinyl ESD floor tiles are probably the most expensive approach to "permanent" flooring, about $8 a square installed. VPI and 3M are reputable suppliers. Let me digress on ESD floor "waxes", the earlier poster�s comments are well taken, but the bigge
Electronics Forum | Sat May 01 07:23:49 EDT 2004 | davef
The large copper pours in the vacinity of this part make it essential that you get your thermal recipe correct. You may need to slow down your conveyor [decrease the ramp rates] in order to minimize the effect of the board has on the different heati
Electronics Forum | Thu Dec 20 13:29:27 EST 2007 | slthomas
Ahhhh. Sorry. It's been a crap week and I've got a touch of hair trigger fever. Somebody pour me a Scotch. It's noon somewhere.
Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan
There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.
Electronics Forum | Thu Mar 02 14:33:26 EST 2000 | Doug Philbrick
I have a customer wanting to hide the identity of a particular component on a PCB assembly. The product cannot be potted and since the PCB is the product he doesn't want to pour over that one chip for aesthetics reasons. Any ideas on ways to permanen
Electronics Forum | Thu Mar 02 14:33:26 EST 2000 | Doug Philbrick
I have a customer wanting to hide the identity of a particular component on a PCB assembly. The product cannot be potted and since the PCB is the product he doesn't want to pour over that one chip for aesthetics reasons. Any ideas on ways to permanen
Electronics Forum | Tue Jan 13 15:16:12 EST 2004 | drewhmi
A small benchtop system uses a mask, tooled for your part, to arrange the solder spheres onto the BGA, after it has had the excess solder heat-vacuumed off and a new layer of flux applied. The spheres are poured into the cavity, excess decanted off.
Electronics Forum | Mon Jan 09 07:50:53 EST 2006 | slthomas
When I had that luxury I always used a double pass, first wet then dry, to reduce the amount of wet solvent left on the stencil. That also gives it some time to evaporate. If you've got suction I don't know how you'd ever get any through the aperture
