Electronics Forum: powder size difference effects on sac305 (Page 1 of 2)

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Leader tape on partial reels

Electronics Forum | Thu Mar 30 13:53:53 EST 2006 | PWH

We've had poor luck with leaders - inefficient, not cost effective for the price of the parts usually. In my opinion, your best bet is to over-issue parts to a scrap # that works for you (all feeders are different as are machine scrap rates). This

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

What to use SAC305 or SAC405??

Electronics Forum | Mon Apr 16 11:58:07 EDT 2007 | cingsman

I believe SAC305 will result in a lesser amount of Ag3Sn inter-metallic compounds being formed along the joint boundary and in the sphere. Studies have been shown to point out a significant difference between the number and size of Ag3Sn plates in SA

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

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