Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Thu Jan 03 14:12:45 EST 2002 | davef
I know fmonette has a MSD audit check list. Maybe when he posts, he'll give us a MSD control procedure aimed at operations types.
Electronics Forum | Thu Dec 16 16:19:30 EST 2004 | Indy
If your components are moisture sensitive you might want to browse through J-STD-020C.. Its the test procedure for MSL components
Electronics Forum | Mon Jul 17 09:09:42 EDT 2023 | tommy_magyar
Things I would check: - solder paste - reflow profile - stencil printing parameters including support, stencil itself and squeegee - MSL procedures - inspection between pick and place and reflow to check paste printing (ideally SPI) Hope this h
Electronics Forum | Fri Jul 15 05:27:59 EDT 2016 | salini
Thanks for the suggestions..will ask my RnD team to introduce such procedures which can replicate the points you have mentioned. We have initiated to implement the MSD devices proper handling in our factory premises so that field rejections which ar
Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette
As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle
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