Electronics Forum | Mon Nov 13 06:34:18 EST 2006 | cyber_wolf
This fluid is pre-mix from Zestron.
Electronics Forum | Fri Dec 01 07:46:41 EST 2006 | davef
Bridging Causes: * Insufficient flux * Excessive pre-heat * High conveyor speed * Solder contamination
Electronics Forum | Sun Oct 26 21:27:09 EDT 2008 | pyrofire76
pre solder means bump formation is it poassible after OSP we will do bump formation?
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Tue May 22 08:39:23 EDT 2012 | davef
Bridging Causes: Insufficient flux, excessive pre-heat, high conveyor speed, solder contamination [AIM Solder]
Electronics Forum | Wed Jul 17 15:00:37 EDT 2013 | jmiller
what is the effect of pre-dip tank temp. and dip tank temp. on the thickness of the IAg?
Electronics Forum | Fri Jul 26 08:25:25 EDT 2013 | emeto
If there is a way to pre-tin the parts, that might help in forming better joint with gold.
Electronics Forum | Mon Jul 29 05:48:35 EDT 2013 | anilw2006
Thanks for support. Is it any special process of pre-tinng? Regards, Anil wagh.
Electronics Forum | Wed Sep 23 13:56:02 EDT 2020 | emeto
Try to pre-tin the part. This should give you a lot of answers.
Electronics Forum | Fri May 14 11:17:58 EDT 2021 | dontfeedphils
Might be worth looking into a FIFO buffer post-reflow/pre-AOI.
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