Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy
5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi
Electronics Forum | Thu Jan 04 17:26:17 EST 2001 | Cory
We're going to begin conformal coating a few of our assemblies as required by our customer. We're using Kester No clean paste and will use cotton gloves to keep the boards clean while handling. My question is: Do we need to clean the boards prior to
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Jan 05 12:01:26 EST 2001 | Jim M
I've been involved with no-clean flux and conformal coat in the past.It has been my experience that the amount of no-clean flux used is proportionate to how well the conformal coat adheres to the boards.No clean paste did not affect adhesion. The co
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Wed Mar 12 08:03:30 EST 2003 | Surachai
Hi all Pls. help advise. Our board use RMA solder paste (Pb-free Sn96.5/Ag3.0/Cu0.5). Can we use No-clean paste flux (Delta 670S1) in rework process? If it can not be used, why?. Thanks very much for your advice. Surachai
Electronics Forum | Fri Sep 09 15:53:22 EDT 2005 | patrickbruneel
If the white residue is from a no-clean flux or no- clean solder flux core you can leave it on the board. (Consult with the flux or cored solder manufacturer) Because after being encapsulated with conformal coating the residue is sealed from humidity
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
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