Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Tue Jan 23 09:47:02 EST 2018 | dleeper
I've used VJ Electronics Summit series of rework machine. I liked the programing interface. You can used canned scripts for basic removal/replacement processes or you edit/write your own if you want a customized work flow. The machines are very ope
Electronics Forum | Fri Feb 09 09:52:48 EST 2018 | jmedernach
Rather than provide an endorsement of a particular brand, I'd like to give you some factors to consider in your selection: 1.) Bottom heater capacity and capability. The bottom heater is a key driver in a successful rework process. You want to even
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Tue Aug 17 15:58:14 EDT 2010 | rob_thomas
IPC-7711/7721 states under Scope section: "This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly". This is from Rev B of this standard. There are many factors that play a role in the d
Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman
Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J
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