Electronics Forum | Tue May 28 11:34:51 EDT 2002 | bphilips
What types of solder pre-forms are used on connectors?
Electronics Forum | Fri Apr 15 13:46:50 EDT 2005 | steve
They can be expensive and if your using water soluble chemistry you will have to immerse the pre-form into flux. Asking the vendor to provide flux with the pre-form I believe it would dry out prior to use.
Electronics Forum | Sat Aug 18 23:43:33 EDT 2001 | CAL
Pin through paste an option?????????????
Electronics Forum | Mon Aug 20 10:57:29 EDT 2001 | Hussman
This connector requires a hole size of 0.055" diameter. A little too large for pin and paste.
Electronics Forum | Tue May 28 11:31:05 EDT 2002 | markt
I am wave soldering, do I have to change the hole size for solder pre-forms or press-fit?
Electronics Forum | Fri Aug 17 10:01:50 EDT 2001 | Hussman
Howdy All, Just want to know if solder pre-form really work. Any pit falls? Looking to solder a through hole connector (70 pin) in a 0.062" PCB with 10 zone convection reflow oven. My biggest worry is getting enough wetting on both sides of the b
Electronics Forum | Tue Nov 19 15:08:45 EST 2002 | steve
Be careful, if you are using a water soluble chemistry then your pre-forms that are impregnated with flux may dry out prior to use. If your using a no-clean application then ther should be no worries. Aim solder out of Rhode Island is very good with
Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli
Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of
Electronics Forum | Mon Aug 20 11:21:23 EDT 2001 | zanolli
Dear Hussman, Contact me off-line (zanolli@tekais.com)or (401-785-4110) and I will let you know if Teka has a solution. Regards Jim Zanolli
Electronics Forum | Fri Aug 15 08:51:24 EDT 2003 | davef
Contact John Sprovieri at "Assembly Magazine" [ http://www.assemblymag.com/ ]. He wrote an article on lead forming that appeared in the August 2003 issue.
