Electronics Forum | Fri Sep 20 11:11:12 EDT 2019 | SMTA-Ernest
Are you interested in trimming pre-solder or post solder? Roto Form Corp. which I believe is located in Tennessee. This machine incorporates a small rotary cutting head for post solder trimming. Otherwise pre-solder trimming is required suggest co
Electronics Forum | Sun Oct 26 21:27:09 EDT 2008 | pyrofire76
pre solder means bump formation is it poassible after OSP we will do bump formation?
Electronics Forum | Thu Feb 17 18:13:31 EST 2011 | SheanDalton
Humidity, Juliano? Try drying the boards pre solder; oven or dry storage cabinet. If this works, Eureka has good desiccant dry storage cabinets, http://www.atekllc.com. Shean Dalton www.fhpreps.com
Electronics Forum | Thu Oct 15 15:34:16 EDT 1998 | Andrew
We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are currently
Electronics Forum | Sat Jan 03 17:43:31 EST 2009 | proy
Hi Wondering if anyone here is/are filemaker Pro users? I am writing a simple data collection program in Filemaker for pre-solder, pre-test inspection to replace paper sheets. Together with wireless touchscreen tablets I think this is going to be
Electronics Forum | Thu Jul 17 16:07:23 EDT 2003 | davef
So, how do you know it's "oxidation"? If the parts didn't solder, why aren't the parts the problem? Do the parts take-on solder? Please describe: * Appearance of the post-solder components. * Scope and extent of the problem. * Appearance of the po
Electronics Forum | Tue Oct 30 14:39:41 EST 2001 | markhoch
Has anybody else out there had problems with SMT connectors with plastic locating pins lifting up during the reflow process? We've had several instances with several differant types of SMT connectors lifting up during the reflow process. We've even g
Electronics Forum | Thu Oct 07 12:14:14 EDT 2004 | bschreiber
The pre-solder cleaning of misprinted PCBs can be a completely different experience from a post-solder application. While the paper that DaveF references is excellent, you may want to read the paper by Richard S. Clouthier, "SMT Stencil Cleaning: A
Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis
1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe
Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
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