Electronics Forum | Fri Sep 08 15:15:55 EDT 2006 | Claude_Couture
how about "unquantifyable predicted behaviour"?
Electronics Forum | Tue Jan 29 15:03:14 EST 2008 | clampron
We have a Kic 2000 9 channel. The options for this unit were 9 or 12. I do not remember what we paid for it but the Kic Navigator and its prediction capabilities really reduce required profile time. I have also used Datapak and Mole but not for year
Electronics Forum | Tue Mar 02 02:46:36 EST 2021 | Jessie Gao
If there is a way to ensure that the product is reliable, it is to ensure the predictability of its PCB, which is an important part of the product. In fact, PCB is the core component in almost all electronic products (from phones to computer systems)
Electronics Forum | Tue Mar 09 19:53:22 EST 2021 | omarsmt
There are software companies out there who can help predict when SMT machines will falter or help identify line utilisation losses. They use sensors as and when required with certain machines. Are there companies also looking to do this? What has th
Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL
Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi
Electronics Forum | Wed May 15 10:55:35 EDT 2002 | geoff_goring
As I thought..... This is probably why most journals and standards I have studied hold shy of even attempting to predict shelf life. They certainly hold off of any predictions when based on accelerated life testing too. The component lead is a cop
Electronics Forum | Fri Nov 28 04:16:33 EST 2003 | stoney_tsai
Hi, all, I have done an analysis through Statistics on solder volume whose purpose is to identify the required volume for different pitch printing (0.65 or above, 0.50, and 0.40 mm). Finally, came out a regression model. But, I need to evalua
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Tue Nov 05 10:18:24 EST 2013 | markhoch
10%,"SAFE","ORDER STENCIL") I like tracking it this way because it self calculates when I input my production data. I don't have to do anything other than to look at it every day and see if one of the stencil cells have triggered, prompting me to pl
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
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