Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC
Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de
Electronics Forum | Fri Feb 16 02:00:12 EST 2001 | PeteC
Dreamsniper, The optimum contact (dwell) time in the wave should be 2 seconds. Contact band width is a function of conveyor speed. For an example, 5cm of contact band width at 150cm/min. conveyor speed will give you 2 seconds of contact time and 2cm
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
Electronics Forum | Mon Nov 01 21:50:32 EST 1999 | chartrain
No clean flux is really a misnomer. What is often taken to mean no residue in effect means no visible residue. Because you can't see it doesn't mean it isn't here. Many manufacturers have been through this same learning curve. The goal with a no clea
Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F
Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin
