Electronics Forum | Thu Aug 09 16:41:12 EDT 2001 | johnw
Dave , you know it's your cheery disposoition I love.... Ok so the process: Process is Double sided reflow for SMT & PTH via the wave. Like I said or did I, I forget and can't check back...it's a spray fluxer with noclean mutlicore NR3s-06 water b
Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef
It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge
I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h
Electronics Forum | Tue May 07 05:55:58 EDT 2002 | ianchan
Hi mate, do you mean : 1) Au = "ENIG" or "immersion Au(gold)"? or 2) Ag as in = "silver"? If Au is the correct term, no need to make extreme changes in your profile. just keep the profile to within your paste specs of preheat, reflow time and reflo
Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf
Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo
Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ
Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
