Electronics Forum | Tue Mar 09 17:58:09 EST 2004 | davef
Vijay: Questions are: * Where are the shorts occuring? * Would you please describe your preheat / underside heating methods?
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Tue Mar 09 19:40:47 EST 2004 | Vijay
The shorts happen at corner of the BGA. The PCB thickness is 1.6mm, It is a PC motherboard with all thru hole connectors mounted on.The preheating is done using IR heater and the temp is 120-160 for about 70-80 sec.I am using ERSA IR550A
Electronics Forum | Tue Mar 09 19:40:55 EST 2004 | Vijay
The shorts happen at corner of the BGA. The PCB thickness is 1.6mm, It is a PC motherboard with all thru hole connectors mounted on.The preheating is done using IR heater and the temp is 120-160 for about 70-80 sec.I am using ERSA IR550A
Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ
Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme
Electronics Forum | Wed May 15 19:55:19 EDT 2002 | russ
Good point, I am preheating for 90 sec to a temp of 170 C. (PCBA) then reflowing for 40 sec. to bring it to 215 C. I will try a softer hammer. This has been working on other assemblies with the same package however. Do you know if a water soluble
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Thu Apr 01 11:53:33 EST 2004 | russ
You may want to tack a coup[le of leads first, making sure that the component is fully seated against the PCBA. Or what we do is apply solder to the E-Pad and the lead pads and then hit it with a "heat gun" until the solder melts on the E-Pad and th
Electronics Forum | Wed Nov 15 15:51:21 EST 2006 | RJ K.
I have been looking into buying a rework station like ERSA or PDR. What I am questioning is how well will these systems reflow BGA's with metal top/cover that are reflective. In addition, when preheating the board would dark body packages absorb te
Electronics Forum | Fri Nov 22 12:34:14 EST 2002 | timreisenleiter
I am in the process of sourcing and ordering a BGA rework station. I only have exprerience with the OK-Industries (Now Metcal) BGA-3500 BGA rework system. Any experience/input on other comparable systems would be much appreciated (Pace TF3000, Air-
