Electronics Forum | Sat Apr 14 00:04:21 EDT 2001 | zam_bri
I'm not a Wave soldering guy and my friend have asked me a question on what is the best preheat time and temperature for Wave soldering.They experiences only 10% flow up thru the PTH barrel. I've asked them to increase the temperatue to 120 Deg C. Cu
Electronics Forum | Tue Dec 11 02:44:26 EST 2001 | ianchan
SMT Experts, Hi, I have a pondering issue, which is : Our current specified Reflow preheat timing is a necessary 100~140sec for the ranges of 100~170Deg-C....obtained timing is 77sec... out of curiousity, if we further fine tune the obtained reflo
Electronics Forum | Tue Feb 14 10:25:04 EST 2017 | swag
Pre-heat, pre-heat, pre-heat! Swap out your acetylene with some propane. Problem solved. Throw a potato in your solder pot while your at it...
Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell
A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad
Electronics Forum | Tue Jul 30 10:44:20 EDT 2019 | vchauhan
Can anyone please share a document which details about the soldering defects if you have less or the excessive preheat time, soak time, peak temperature, time above liquidous (TAL)and cooling time. Appreciate your help in advance.
Electronics Forum | Tue Jul 18 04:05:58 EDT 2006 | EC
Hi, For the past few weeks, we been seeing solder hole after reflow and this product been running for almost a year. We had try to shorter and longer the pre-heat time, reflow time and even reduce and increase the temperature....but could not help..
Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme
Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim
A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp
Electronics Forum | Wed Feb 25 21:37:12 EST 2015 | dinhhuunam
Hi Bartel , 1.1 Profile Solution to Cold Soldering Cause for Cold soldering The peak temp of reflow is too low. The preheating temp is too high and it takes too long Solution Lower the preheating temp and increase the peak temp in the reflow zone
