Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Mon Dec 18 17:56:26 EST 2000 | Dave F
Does the thermal conductivity of a copper trace on a printed circuit board change as the copper oxidizes? Is the oxide on copper a thermal insulator? If so, should it be considered in an analysis of thermal resitivity between a ground plane and a h
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
Electronics Forum | Thu Apr 19 19:31:14 EDT 2007 | davef
Try this: http://www.unitconversion.org/unit_converter/thermal-conductivity.html
Electronics Forum | Thu Sep 03 01:57:11 EDT 1998 | Reginald Aquino
Has anyone know of a low viscosity conductive paste/liquid that has good thermal conductivity? My aim is to get better consistency in the electrical and thermal conductivity between the mounting flange of Microwave power devices and anodised carrier
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Wed Mar 10 12:02:07 EST 1999 | Craig Holloway
Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. Need a way to get good thermal contact between par
Electronics Forum | Thu Mar 11 11:58:18 EST 1999 | P.L. Sorenson - Technical Consultant
| Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. | | Need a way to get good thermal contact betwe
Electronics Forum | Wed Apr 18 21:35:26 EDT 2007 | davef
Thermal conductivity [W/m-*C] * Conformal coating [AR, ER, UR]: 17-21 * Epoxy molding compound: 0.6
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