Electronics Forum: pressfit desoldering (Page 1 of 1)

Re: BGA Bouble sided reflow overlapping

Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko

What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr

  1  

pressfit desoldering searches for Companies, Equipment, Machines, Suppliers & Information

SMT spare parts - Qinyi Electronics

Component Placement 101 Training Course
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
SMT spare parts

Low-cost, self-paced, online training on electronics manufacturing fundamentals