Electronics Forum | Thu Feb 27 17:24:34 EST 2003 | pauld
Forgive the non-SMT question. That's why I hate through hole boards. Has anyone ever used Bareco wax on pressfit connectors, and how do you produce a consistent process for its application? Any drawbacks? Background: We have found a design issue with
Electronics Forum | Fri Feb 28 11:08:56 EST 2003 | pauld
I had the same concern. The connector pins are gold also. I am waiting for a response from AMP to supply some of this wonder wax. I can inspect the HASL fabs for proper hole diameter, but I do not have a warm feeling I should be getting involved with
Electronics Forum | Fri Feb 28 00:46:53 EST 2003 | MA/NY DDave
Hi I don't believe I have ever done this or seen it, yet maybe since there are some other lube processes. Ask the Amp Guy for any older App Notes. They used to have a lot. If I got this right you could put it on the board with an applicator that c
Electronics Forum | Tue Feb 02 10:12:50 EST 1999 | Justin Medernach
| Does anyone have any reliability data /concern on pressfit rework/repair - is there any qualified /characterized equipment /tools present in the industry? | What kind of effect does it have on barrel plating quality (1.5mil avg.) after 1 time rewor
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Mon Mar 10 02:54:22 EST 2003 | sankar
Dear All, Can you advice on how to use X-Ray system to identify the QFP/PLCC pin open application. Whether at all X-Ray can be used for the above application. If so, what will be the false rejection of the X-Ray system. Regards Sankara narayanan ME
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward
I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is
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