Electronics Forum | Tue Feb 08 14:23:47 EST 2011 | dennisfo
Conformal coat bubbles using 1B73 and SC-205 nozzle I've read most of the posts on this subject. I'm using the SC-205 (airless) fan nozzle and 400 needle to apply 1B73 mixed with xylene thinner. I have micro bubbles which come directly out of the noz
Electronics Forum | Fri Feb 18 08:08:55 EST 2011 | floydf
I have found that depressurizing the tanks when the machine is not in use reduces bubbles.
Electronics Forum | Tue Mar 01 15:33:35 EST 2011 | jlawson
If I assume you running a selective coating machine ? Maybe you have small leak and system is sucking in air creating bubbles in mixture, like a sort of venturi action, just idea, can be a faulty fitting , elbow etc. Have had this before....
Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr
Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af
Electronics Forum | Wed Dec 02 20:11:37 EST 2009 | prodivegsr
Hi Lou, we are using a fluid dispensing machine. our current requirement is around 50um. From the Datasheet,the thinner 73 has a higher evaporation rate of 1.0 comapring with thinner 521 at 0.6... does the higher evaporation rate eliminate the bu
Electronics Forum | Sun Nov 22 18:40:47 EST 2009 | 89jeong
Hi The bubble shows only around component body after ir reflow. I think bubble means that there is a moisture. How do you dry the PCB(?) before IR reflow? Thanks Ju-young.
Electronics Forum | Sun Nov 22 19:53:10 EST 2009 | prodrivegsr
Hi Ju Yong, The PCB are dry in an airseal cabinet(Staging Chamber) before IR Oven. The bubbles show at around body and solder joint area. You mean the moisture will create bubbles ? Able to advice the humidity and temperature that you are using in
Electronics Forum | Sun Nov 22 19:59:26 EST 2009 | prodivegsr
Hi Davef, The bubbles occurs at the body also...there's also a washing process before the conformal coating:-the Flux residue are removed after washing. ... The curing profile is also something that we are looking into during the initial troubles
Electronics Forum | Thu Nov 19 22:48:22 EST 2009 | davef
Since the bubbles: * Are only on the solder connection, we'd guess there must be some compatibility issue between the flux residues and the conformal coat materials. * Occur after curing, we'd guess the cure recipe is too rapid and is entrapping voli
Electronics Forum | Tue Dec 01 09:24:01 EST 2009 | sforman1
40 years. no cost to you. just trying to help Sam
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