Electronics Forum | Mon Jun 14 16:49:08 EDT 2004 | Dreamsniper
Can I manually tin them with solder specially the BGA's. Will that improve the solderability? What about corrosion of the copper? will it be prevented with the above process considering that after tinning of solder the solderability became acceptable
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef
Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes
Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach
| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon
| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper
| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an
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