Electronics Forum | Fri Aug 01 08:10:29 EDT 2008 | scotceltic
Has anyone come across a standard or study (JEDEC, IPC) where it has the recommended shelf life outside of a dry box for immersion silver coated PCB's to prevent oxidation from affecting the soldering process (Both reflow and Wave). I know it will
Electronics Forum | Thu Aug 05 11:47:10 EDT 2004 | Andrew
What are the preferred material for metal sheet?What can be done to prevent oxidation?What are the process available at Metal Sheet fabrication company?
Electronics Forum | Sat Oct 28 08:41:37 EDT 2000 | Aaron
1. Check printing accuracy. 2. Check placement accuracy. 3. Your components should be kept in a good environment to prevent oxidation of terminations. 4. Pads pattern should be designed according to standards. If 1.2. are okay, you should suspect 3
Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez
I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Mon Jan 07 12:12:55 EST 2008 | ck_the_flip
Another thing I'm curious about. What is the "functional purpose" of soldering stainless? Solder coatings generally prevent oxidation on surfaces, but why would somebody solder STAINLESS? Stainless, by nature, is resistant to rust, and hence, oxid
Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee
I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate
Electronics Forum | Thu Sep 27 17:25:33 EDT 2007 | chef
The short answer is immediately after reflow the problem occurs. To be more exact, what you are describing is not "rust". Rust occurs in iron. The oxidation that occurs in Tin-Lead has been sometimes called "white rust". Either way, oxidation occur
Electronics Forum | Thu Aug 20 09:47:46 EDT 1998 | Dave F
| Will somebody please explain HASL (here). Thanks. Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F
Electronics Forum | Thu Nov 11 15:55:53 EST 2010 | davef
We guess the nickle has a rougher that normal finish AND the gold is at or below your specification. The nickle bumps are poking through the gold and are oxidized, preventing contact with you ATE probes. If this is correct, it would be interesting
