Electronics Forum | Mon Sep 22 23:27:09 EDT 2003 | severs
By "hacking" do you mean altering the performance of the board or something else? This reminds me of something I saw a while back. Better termed counterfeiting than hacking, it may have some relevance to what your friend is trying to do. The probl
Electronics Forum | Wed Sep 24 20:04:44 EDT 2003 | Michel Moninger
http://www.mgchemicals.com/products/832.html Loctite makes a version too, if I recall. Designed to be tamper evident, but yes, rework is a bear. We had similar results using one of Lord Chemical's urethane potting compounds. It was a filled black fi
Electronics Forum | Fri Nov 25 00:07:23 EST 2005 | pyramus
Nope actually the whole bluetooth component is a raw part comprising of BGA and chip components in one small PCB wherein this whole assembly is encased in a shield. So basically when we recieve the part we can only see the shield and some minor chi
Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea
I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which
Electronics Forum | Fri Nov 25 09:01:24 EST 2005 | Amol
cookson has something they call "cool caps" that reduces the delta T across the component top surface, something you might wanna explore to reduce the delta T even further....FYI, I am not associated with cookson in any way
Electronics Forum | Mon Mar 17 07:00:34 EDT 2008 | ectan5117
Hi, During SMT process, i found that solder splash on the gold pad. The distance between the COB pad with component pad is about 1.25mm. My question is what material can used to cover the COB pad without bringing contamination. And i am welcome to
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Fri Aug 16 11:13:17 EDT 2002 | kenbliss
I have a question for everyone about component baking. In my view this is rework. The component was manufactured and shipped correctly and should not need baking in order to use it. Some how in storing the component in a stockroom atmosphere (I as
Electronics Forum | Sat Mar 24 12:31:31 EDT 2007 | diesel_1t
Hi there. Ok, i have a little big question for fuji Erudites: when machine run out of parts on any device it tells to machine "parts out (and part number)" So, a signal from anywhere (maybe a PLC output) will tell to the machine "hey i'm out of parts
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
